Peace Solar LLC
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PEACE SOLAR LLC...for maximum efficiency.
•The patent associated with this solar wafer design increases
the output efficiency of a solar wafer by at least 27.2%, equal to a minimum of 254 W/m^2.
•The element used is silicon, with quartz as a substrate.
•Use silicon that is 99.9999% pure.
•Doping choices are: NaHCO3 and KHCO3 - (0.4 ppb, 0.6 ppb) respectively.
•An alternative doping choice may be: NaHCO3 at 0.8 ppb.
•A third alternative is to combine CaCO3 at 0.7 ppb with KHCO3 and NaHCO3 at 0.5 ppb.
•A fourth choice may be NaHCO3 and HCO3 each at 0.5 ppb.
•A final choice may be HCO3 at 0.5 ppb and Gold at 1 ppb.
•Keeping the panels cool during operation is very much desired for safety reasons.
•Licensing Inventor: Armando Moncada.
What is new?
• Top Layer: Silicon at 100 degrees for the crystallographic angle.
• Bottom Layer: Quartz, SiO2.
• Wafers are manufactured without graphene, and without additives that represent hazardous materials. No radioactive materials are allowed in the manufacturing. We have chosen to not use graphene to facilitate recycling.
What are the dimensions?
• Silicon wafer layer has a thickness that depends on the number of doping layers used x 20 microns +20 microns. So, if only 1 doping compound is used, then the layer would be 40 microns, if 4 are used it would be 100 microns.
• From valley to peak of the corrugation the overall dimension is 1.30 mm, and the wavelength spacing is 2.60 mm. It is designed to be nearly as temperature neutral as possible.
• At the valley and peak of the corrugation exists a round with a radius of 0.1625 mm equal to 1/8 of the length of the diagonal.
• Thickness of the quartz layer is 0.1 -0.2 mm, measured from the valley of the corrugation to bottom side.
Options for avoiding lead, (tin with lead mixed in), which affects the water supply at the time of recycling...
1) If one is using tin solder, choose lead free tin solder.
2) Use waste heat from the annealing process to sinter copper onto the surface of the silicon wafer. Materials interact in a second heating process or a second oven. Pressure is applied to copper inside of the oven.
3) 3D-Print the copper onto the silicon wafer surface, using metal clays (paraffin wax with metal powder), then burn off the binding resin in a second oven.
(No tin involved in options 2 and 3, it is more optimal to use less materials).